Your question is kind of wide open.
For higher power products, e.g. amps or power conditioners many of the components will need to be fairly big, they might have to dissipate a lot of heat and probably thru hole works best.
For lower power audio frequencies either thru hole or SMT work well.
For higher digital frequencies SMT is the way to go. SMT is much denser. The parasitics of SMT parts are much better (lower inductance from shorter (or no) legs and smaller sizes, lower capacitance from smaller sizes, smaller loop areas to transmit or receive RF, everything is closer to ground so things are quieter…)
You can get essentially as good or better resistors, inductors, ceramic caps, etc. in SMT as thru hole. The raw capacity of capacitors is related to size but (outside of power supplies) the capacities available in SMT packages are fine. Tho it didn’t used to be as true there are some fine capacitors available for audio, e.g. film caps with good dielectrics…
For the DirectStream SMT was the only way to go. Noise matters a lot and things would be much nosier without SMT. Many of the parts I use just aren’t available in non-SMT packages. I use 0.1% +/-25ppm / degree C thin film resistors and 2% caps at all critical places. They aren’t cheap but they are quality parts.
Not being able to do reworks as easily is a problem in SMT, so I had to just not make many mistakes and/or make friends with a good tech.
Glue isn’t an issue if you only put SMT components on one side of the board (they are kept in place until they’re soldered by the surface tension of the solder paste.)
I have no interest in working with non SMT designs - I can get what I need in SMT, the boards are smaller and more reliable (e.g. less stress on smaller components when a board bends or vibrates.)