Bottlenecks inside components

To what measure do modern components have the internal wiring / circuits calculated in terms of power loss, material also, to not cause bottleck?

In the audio pursuit we spend so much on cabling that a proper high end component should have quality internals, right?
Is point to point wiring with (silver) with ultrasonic welding (?) the utimate way?
(Silver with porous teflon dielectric.)

Your question reminds me of when Paul said that they actually auditioned solder for it’s sound quality.

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Look at Audio Note (UK) to get a sense of the associated cost of using silver in wiring, transformers, and caps. These are tube amps with point to point wiring and the prices are “heart stopping” (for me).
Is this what you mean by “proper high end”?
In building amps, DACs, speakers for my own use, I have found that the biggest improvements (to reduce damage) come from utilizing higher quality caps, connectors, vacuum tubes, inductors and so on. Whenever I’ve installed better hookup signal wire, which are generally short runs, I’ve not noticed much improvement in sonics. Recently, I spent less than $150 on new KLE Innovations connectors (speaker terminals and banana wire ends and the improvement, to me, was astounding, more than I expected.

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The effect of optimizing the molecular structure (among others transfer speed and transmissibility) of the signal path (in cabling and components) is by magnitudes more important than the kind of material used but addresses a similar point. Not only detail gets lost in normal circuits’ conductivity. But it’s a bottleneck very expensive to optimize. The “all silver, short path, p2p wired” way is probably the cheapest of the expensive.